Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

• Published in: Microelectronic engineering Vol. 173; pp. 13 - 21
• Main Authors: Montméat, P., Enot, T., De Marco Dutra, M., Pellat, M., Fournel, F.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 05.04.2017; Elsevier BV
• Subjects: 3D integration; Adherence; Adhesive; Bonding; Dismounting; Glass; Grinding; Lasers; Polymers; Silicon; Silicon wafers; Temporary; Ultraviolet radiation; Adherence; Temporary; 3D integration; Bonding; Adhesive
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2017.03.008

This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment. Firstly, the 300mm bonding process leads to a very homogeneous bonded structure without any bonding defects. The morphology of the bonded structure is mainly dependent of the morphology of the glass. Secondly this process is also compatible with a back – grinding process and the thinned silicon structure can be processed up to 250°C. When using a blank silicon wafer, the 3MTM dismounting process (laser and peeling) leads to a silicon thin wafer without any cracks, chippings or adhesive traces. Finally the laser process can be removed from the debonding steps and a single mechanical dismounting process can be used. [Display omitted] •A complete characterization of a silicon/glass temporary bonding for 3D integration is proposed•The bonded structure allows the handling of very thin silicon wafer (80μm)•Processes up to 250°C are compatible with the bonded structure