An approach for hydrophobic fixed abrasive pad based on layer-by-layer method

• Published in: Microelectronic engineering Vol. 238; p. 111505
• Main Authors: Liu, Zhixiang, Tang, Yunqing
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.02.2021; Elsevier BV
• Subjects: Abrasives; Chemical-mechanical polishing; Fixed abrasive chemical mechanical polishing; Hydrophobic groups; Hydrophobic surfaces; Hydrophobicity; Integrated circuits; Layer-by-layer process; Material removal rate (machining); Polishing; Polyurethane resins; Prepolymers; Self-conditioning; Stable polishing process; Substrates; Surface roughness; Systematic review; UV curing; Self-conditioning; Layer-by-layer process; UV curing; Fixed abrasive chemical mechanical polishing; Hydrophobic groups; Stable polishing process
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2021.111505

Fixed abrasive polishing pad plays an important role in planarization of the surface of integrated circuit and semiconductor substrate. This paper reports a systematic approach for fabricating the pad using polyurethane, metal mold and layer-by-layer curing without binders. The pad surface with uniformly and orderly arranged convexities is undamaged during the fabrication process. Because of using prepolymer with hydrophobic groups, self-conditioning, stable polishing process and no water swelling are observed during the polishing process. The experimental results show the material removal rate is 72.972 nm/min and the polished surface roughness is 0.007 μm for SiC wafer. It builds a basis for high efficient preparation technology on hydrophobic fixed abrasive pad. [Display omitted] •Appropriate proportion of hydrophobic prepolymer, active diluents, photo initiator, additives and abrasive particles is proposed to fabricate FA-CMP pad.•The connection between pad layers is firm without binder and water swelling performance is prevented.•The prepared FA-CMP pad has self-conditioning and stable performance during polishing.•This is a simple and general process which is proven as an easy and environment-friendly way for high efficient preparation technology on hydrophobic fixed abrasive pad.