Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation

• Published in: IEEE transactions on advanced packaging Vol. 33; no. 4; pp. 924 - 937
• Main Authors: Miana, Mario, Cortes, Cristobal, Pelegay, Jose Luis, Valdes, Jose Ramon, Putz, Thomas
• Format: Journal Article
• Language: English
• Published: Piscataway, NJ IEEE 01.11.2010; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Cooling; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Heat transfer; Integrated circuits; Integrated circuits by function (including memories and processors); Read only memory; Reduced order models; scale analysis; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solids; Temperature; Transient analysis; unsteady heat transfer; Read only memory(ROM); Integrated circuit; Thermal behavior; Reduced order model; Reduced order models; unsteady heat transfer; scale analysis; Transfer processing; Heat transfer
• ISSN: 1521-3323; 1557-9980
• DOI: 10.1109/TADVP.2010.2074200

This paper formulates the methodology of transient thermal network modeling (TTNM) for the study of unsteady heat transfer in systems where the presence of multiple length and time scales prevents the analysis by means of current computational or experimental techniques. The TTNM is based on reduced order models (ROMs) and it is established under the essential premise that a transient heat transfer process can be modeled by its division in a succession of stationary states and the division of the geometry in isothermal elements, according to the characteristic time and length scales obtained by scale analysis. The methodology is subsequently validated with canonical examples and considerations are given for the application to practical problems.