Effect of SiC nanowires on the mechanical properties and thermal conductivity of 3D-SiCf/SiC composites prepared via precursor infiltration pyrolysis

•A new interface structure of PyC+SiCNWS was prepared on the surface of SiC fiber.•The damage evolution process of SiCf/SiC was analysed by acoustic emission.•The mechanism of influence of SiCNWS on the thermal conductivity of 3D-SiCf/SiC composites was analysed. In this study, SiC nanowires (SiCNWS...

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Bibliographic Details
Published inJournal of the European Ceramic Society Vol. 41; no. 10; pp. 5026 - 5035
Main Authors Cui, Guang-Yuan, Luo, Rui-Ying, Wang, Lian-Yi, Huang, Peng
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.08.2021
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Summary:•A new interface structure of PyC+SiCNWS was prepared on the surface of SiC fiber.•The damage evolution process of SiCf/SiC was analysed by acoustic emission.•The mechanism of influence of SiCNWS on the thermal conductivity of 3D-SiCf/SiC composites was analysed. In this study, SiC nanowires (SiCNWS) were grown in situ on the surface of PyC interface through chemical vapor infiltration (CVI) to improve the mechanical characteristics and thermal conductivity of three-dimensional SiCf/SiC composites fabricated via precursor infiltration pyrolysis (PIP). The effect of SiCNWS on the properties of the obtained composites was investigated by comparing them with conventional SiCf/PyC/SiC composites. After the deposition of SiCNWS, the flexural strength of the SiCf/SiC composites was found to increase by 46 %, and the thermal conductivity showed an obvious increase at 25−1000 °C. The energy release of the composites in the damage evolution process was analysed by acoustic emission. The results indicated that the damage evolution process was delayed owing to the decrease in porosity, the crack deflection and bridging of the SiCNWS. Furthermore, the excellent thermal conductivity was attributed to the thermally conductive pathways formed by the SiCNWS in the dense structure.
ISSN:0955-2219
1873-619X
DOI:10.1016/j.jeurceramsoc.2021.04.003