High Speed Optical Data Transmission With Compact 850 nm TO-Can Assemblies

• Published in: IEEE journal of quantum electronics Vol. 50; no. 4; pp. 281 - 286
• Main Authors: Turkiewicz, Jaroslaw P., Kropp, Jorg-R, Ledentsov, Nikolay N., Shchukin, Vitaly A., Schafer, George
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.04.2014; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: 850 nm; Adaptive optics; Assemblies; Data transmission; Electronics; High-speed optical techniques; Links; Optical attenuators; optical communication; Optical distortion; Optical fibers; optical interconnect; Optical interconnects; photodetector; Power supplies; Receivers; Spreads; Transmitters; VCSEL; Vertical cavity surface emitting lasers
• ISSN: 0018-9197; 1558-1713
• DOI: 10.1109/JQE.2014.2304742

Key components of the optical interconnects are the fully integrated optical transmitter and receiver subassemblies. The required features of such components include high bit rate and energy efficient operation in the wide range of operating conditions as well as small dimensions. In this paper, operation of the transmitter and receiver micromodules integrated with the driving electronics into the TO-can packages is demonstrated. The evaluated TOSA and ROSA 850 nm link had a convolved -3 dB bandwidth of ~ 21 GHz. Data transmission utilizing TOSA and ROSA pair up to 28 Gb/s is demonstrated in temperature range of 25°C/85°C with the nominal and up 43% reduced power consumption as well as the limited to 330 mVpp driving voltage. Results of the multiple TOSA and ROSA link measurements show limited performance spread. Finally, error-free operation up to 38 Gb/s is presented. The obtained results indicate a high potential of 850 nm VCSEL and PIN-based TO-can assemblies for the next generation of energy-efficient high bit rate optical interconnects.