Dynamic analysis of bifurcating, non-linear thin film micro-structures

As micro-device application in consumer and commercial products develops, efficient tools are required to simulate device dynamics and assess structural performance. An integrated methodology is developed for studying the dynamics of thin film bifurcating structures. Results are presented for a gene...

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Bibliographic Details
Published inEngineering structures Vol. 26; no. 12; pp. 1821 - 1831
Main Authors Carey, M.W., Chase, J.Geoffrey, Carr, A.J., Kowarz, M.W.
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier Ltd 01.10.2004
Elsevier
Subjects
Applied sciences
Bifurcation
Buildings. Public works
Computation methods. Tables. Charts
Dynamic
Electrostatic
Exact sciences and technology
Finite element
Geometric stiffness
Hybrid stress
Large deflection
Newmark constant average acceleration
Residual stress
Stresses. Safety
Structural analysis. Stresses
Dynamic
Electrostatic
Bifurcation
Large deflection
Geometric stiffness
Hybrid stress
Residual stress
Finite element
Newmark constant average acceleration
Structural design
Building performance
Thin film
Building dynamics
Numerical simulation
Acceleration
Electrostatics
Microelectromechanical device
Structural analysis
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Summary:As micro-device application in consumer and commercial products develops, efficient tools are required to simulate device dynamics and assess structural performance. An integrated methodology is developed for studying the dynamics of thin film bifurcating structures. Results are presented for a generic thin film structure, which exhibit classical electro-mechanical hysteresis. Such structures can be used to produce light modulating micro-electro-mechanical system (MEMS) devices.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0141-0296
1873-7323
DOI:10.1016/j.engstruct.2004.06.019