On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level - Part II

The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of noncompliance due to design weakness. In Part I, a worst-case estimator of the far-f...

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Bibliographic Details
Published inIEEE transactions on electromagnetic compatibility Vol. 64; no. 5; pp. 1493 - 1505
Main Authors Boyer, Alexandre, Nolhier, Nicolas, Caignet, Fabrice, Dhia, Sonia Ben
Format Journal Article
LanguageEnglish
Published New York IEEE 01.10.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Institute of Electrical and Electronics Engineers
Subjects
Calibration
Circuit boards
Couplings
Electronics
Engineering Sciences
Far fields
Immunity
Induced voltage
Integrated circuits
Lighting
Near fields
Near-field (NF) probe
near-field scan
Noise measurement
Printed circuits
Probes
radiated susceptibility (RS)
Testing
Voltage
Near-field scan
radiated susceptibility
nearfield probe
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Summary:The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of noncompliance due to design weakness. In Part I, a worst-case estimator of the far-field induced voltage on a PCB trace was proposed. Based on it, an estimator of the radiated susceptibility of a printed circuit board based on near-field scan results is derived and validated through two validation case studies.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2022.3172601