Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

• Published in: Electronics (Basel) Vol. 12; no. 14; p. 3154
• Main Authors: Oukaira, Aziz, Said, Dhaou, Zbitou, Jamal, Lakhssassi, Ahmed
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.07.2023
• Subjects: Cooling; Cost analysis; Design; Designers; Embedded systems; Finite element analysis; Finite element method; Flexibility; Heat conductivity; Integrated circuits; Mathematical analysis; Mathematical models; Packaging; Random access memory; Semiconductors; Technology; Temperature; Temperature distribution; Thermal analysis; Thermal management; Thin films; Transistors
• ISSN: 2079-9292; 2079-9292
• DOI: 10.3390/electronics12143154

This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal performance of the SiP model by utilizing Chip Cooling Laminate Chip (CCLC) technology. To achieve this, we employed finite element method (FEM) analysis using COMSOL Multiphysics® and MATLAB® to compare the results of electrical and thermal SiP models with and without CCLC technology. The numerical simulations revealed that, as opposed to the traditional model, the temperature variation decreased significantly with a uniform temperature distribution when employing the CCLC technology. Additionally, the thermal conduction performance of the packaging system using CCLC demonstrated remarkable reliability and resolution with cost-effective micro-devices, particularly in micro-medicine applications. The analysis of the electrical and thermal models reported a maximum error between them of 1.15 ∘C.