Composite materials for Hi-Tech printed circuit boards

• Published in: IOP conference series. Materials Science and Engineering Vol. 675; no. 1; pp. 12044 - 12051
• Main Author: Medvedev, A M
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.11.2019
• Subjects: Avionics; Circuit boards; Composite Materials; Conductors; Dielectric; Dielectric loss; Dimensional stability; Electronic components; Electronics; LTCC-ceramics; Printed circuit boards; Printed circuits; Printed Circuits Boards; PTFE; Scin-Effect; Skin effect; Transmission lines
• ISSN: 1757-8981; 1757-899X
• DOI: 10.1088/1757-899X/675/1/012044

The development of printed circuit board technology is subject to the general trend of electronics development - an increase in functionality and performance. This requires printed circuit boards to increase the assembly density of electronic components and interconnections and reduction of constructive delays in transmission lines of information. In turn, this requires the use of base materials with good dimensional stability and reduced values of dielectric permittivity and dielectric losses. Operability of gigabit electronics largely depends on the state of the surface of the printed conductors, since at high frequencies it is affected by the skin effect. Producers of basic materials, trying to meet these requirements, remain in the field of composite materials, so as not to change the structure of the existing production, based on the use of basic technologies of printed circuit boards. This article is based on the presentation of the properties of new materials from the catalogs of the companies Panasonic, Hitachi (Japan) and Isola (Germany).