Microcapsules composed of stearic acid core and polyethylene glycol‐based shell as a microcapsule phase change material

Summary The shell materials of the existing microcapsule phase change materials (PCMs) are always not PCMs, so the enthalpy change (ΔH) in the phase transition processes of these microcapsule PCMs is much smaller compared with the pure encapsulated PCMs (the core materials), reducing the storage abi...

Full description

Saved in:
Bibliographic Details
Published inInternational journal of energy research Vol. 45; no. 6; pp. 9677 - 9684
Main Authors Wang, Rui, Kang, Yujie, Lei, Tianxu, Li, Sijia, Zhou, Ziyi, Xiao, Yao
Format Journal Article
LanguageEnglish
Published Chichester, UK John Wiley & Sons, Inc 01.05.2021
Hindawi Limited
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Summary The shell materials of the existing microcapsule phase change materials (PCMs) are always not PCMs, so the enthalpy change (ΔH) in the phase transition processes of these microcapsule PCMs is much smaller compared with the pure encapsulated PCMs (the core materials), reducing the storage ability for thermal energy of the microcapsules. Herein, we prepared microcapsules composed of stearic acid (SA) core and polyethylene glycol (PEG)‐based shell as a microcapsule PCM. The PEG‐based shell is a solid‐solid PCM with cross‐linked network, which is in solid state even at 80°C, avoiding the leakage and lose of the whole microcapsule PCM. Additionally, the microcapsule PCM has high ΔH of 113.4 and 115.3 J g−1 during their solidification and melting procedures respectively, displaying outstanding storage capacity for thermal energy. The microcapsule PCM shows dual temperature range in the melting/solidification process resulting in a wide effective temperature range, and has better thermal stability than pure SA. Moreover, the thermal property of the microcapsules changes a little after 100 times of thermal cycling, indicating high thermal reliability of the material.
ISSN:0363-907X
1099-114X
DOI:10.1002/er.6431