Application of UV depth lithography in micro system technology

This letter reports on new types of photo resists allowing UV-light exposure of thick layers. Optimized processes Cthat for the positive resist AZ 9260 and the negative resist Epon SU-8 have been developed enabling the fabrication of high aspect ratio metallic and polymer micro components. The high...

Full description

Saved in:
Bibliographic Details
Published inOptoelectronics letters Vol. 4; no. 1; pp. 1 - 4
Main Authors Büttgenbach, Stephanus, Feldmann, Marco
Format Journal Article
LanguageEnglish
Published Tianjin Tianjin University of Technology 2008
Institute for Microtechnology, Technical University of Braunschweig Langer Kamp 8, 38106 Braunschweig, Germany
Subjects
Lasers
Optical Devices
Optics
Photonics
Physics
Physics and Astronomy
TN256
Online AccessGet full text

Cover

More Information
Summary:This letter reports on new types of photo resists allowing UV-light exposure of thick layers. Optimized processes Cthat for the positive resist AZ 9260 and the negative resist Epon SU-8 have been developed enabling the fabrication of high aspect ratio metallic and polymer micro components. The high potential of this technology will be demonstrated on the basis of two examples, a variable reluctance micro motor with compensated attractive force and an optical microphone developed for application in electro-magnetic interference environments.
ISSN:1673-1905
1993-5013
DOI:10.1007/s11801-008-7099-2