Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

• Published in: Macromolecular research Vol. 18; no. 1; pp. 47 - 52
• Main Authors: Cho, Jae-Choon, Lee, Hwa-Young, Lim, Sung-Taek, Park, Moon-Soo, Oh, Yong-Soo, Cho, Mi-Suk, Lee, Young-kwan
• Format: Journal Article
• Language: English
• Published: Heidelberg The Polymer Society of Korea 2010; 한국고분자학회
• Subjects: Characterization and Evaluation of Materials; Chemistry; Chemistry and Materials Science; Complex Fluids and Microfluidics; Nanochemistry; Nanotechnology; Physical Chemistry; Polymer Sciences; Soft and Granular Matter; 고분자공학; epoxy resin; PCB; surface roughness; curing; peel strength
• ISSN: 1598-5032; 2092-7673
• DOI: 10.1007/s13233-009-0095-y

Insulating films for hand-held phone printed circuit boards (HHP PCBs) were manufactured from a variety of epoxy resin formulations. The epoxy resin formulations were prepared by varying the curing accelerator content. The curing behavior was investigated by viscosity measurements under isothermal conditions using a rheometer. The films were used in a general PCB manufacturing process and their adhesiveness to the electroplating layer was confirmed by peel strength tests. Their surface morphology after desmearing was examined by SEM. The peel strength of the epoxy films with a copper layer was directly dependent on their surface roughness.