Hybrid Pixel Detectors for gamma X-ray imaging

• Published in: Journal of physics. Conference series Vol. 637; no. 1; pp. 12015 - 12018
• Main Authors: Hatzistratis, D, Theodoratos, G, Zografos, V, Kazas, I, Loukas, D, Lambropoulos, C P
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 16.09.2015
• Subjects: Active pixel sensors; Aperture imaging; Application specific integrated circuits; Circuit design; CMOS; Computed tomography; Dental materials; Direct conversion; Elastic scattering; Energy resolution; Flat panels; Infrared detectors; Photomultiplier tubes; Physics; Pitch (inclination); Pixels; Semiconductor devices; Sensors; Thin film transistors; X ray imagery
• ISSN: 1742-6588; 1742-6596
• DOI: 10.1088/1742-6596/637/1/012015

Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.