Characterization of WC–CrAlN heterostructures obtained using a cathodic arc ion plating process

• Published in: Surface & coatings technology Vol. 174; pp. 303 - 309
• Main Authors: Lee, Ho Y., Han, Jeon G., Baeg, Seung H., Yang, Se H.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.09.2003
• Subjects: Buffer layer; Heterostructure; WC–CrAlN; Buffer layer; Heterostructure; WC–CrAlN

New WC–CrAlN heterostructure films were deposited on Si wafer and S45C steel substrate by a cathodic arc ion plating (CAIP) process. The Al concentration and bilayer repeat period (λ; 2–10 nm) were controlled to obtain a nano-layered structure. We have characterized our samples using X-ray diffracti...