Influence of filler morphology on percolation threshold of isotropical conductive adhesives (ICA)

Different aspect ratio silver nano-structured materials including nanocubes, nanorods and nanowires were prepared by microwaved assisted glycol reduction method. Different characterization methods including SEM and XRD were processed on these nanomaterials. Isotropical conductive adhesives (ICA) wer...

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Bibliographic Details
Published inScience China. Technological sciences Vol. 55; no. 1; pp. 28 - 33
Main Authors Tao, Yu, Yang, ZhenGuo, Lu, XiaoLu, Tao, GuoLiang, Xia, YanPing, Wu, HaiPing
Format Journal Article
LanguageEnglish
Published Heidelberg SP Science China Press 2012
Subjects
Engineering
Fillers
Morphology
Nanomaterials
Nanorods
Nanostructure
Percolation
Silver
Thresholds
aspect ratio
ICA
percolation threshold
simulation
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Summary:Different aspect ratio silver nano-structured materials including nanocubes, nanorods and nanowires were prepared by microwaved assisted glycol reduction method. Different characterization methods including SEM and XRD were processed on these nanomaterials. Isotropical conductive adhesives (ICA) were developed by using these Ag nanomaterials as conductive fillers. It was found that the conductivity and thermal conductivity percolation threshold of the ICA depended on the morphologies of the fillers, lower percolation threshold could be obtained by using higher aspect ratio filler. A modified percolation threshold theory was put forward to explain and simulate the experiment results, the simulated results could match the experiment results very well.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1674-7321
1869-1900
DOI:10.1007/s11431-011-4651-2