Wire bow analysis based on process parameters in diamond wire sawing

• Published in: International journal of advanced manufacturing technology Vol. 131; no. 5-6; pp. 2909 - 2924
• Main Authors: Guo, Yufeng, Gao, Yufei, Zhang, Xingchun, Shi, Zhenyu
• Format: Journal Article
• Language: English
• Published: London Springer London 01.03.2024; Springer Nature B.V
• Subjects: Advanced manufacturing technologies; CAE) and Design; Computer-Aided Engineering (CAD; Cutting force; Cutting parameters; Diamond machining; Efficiency; Engineering; Industrial and Production Engineering; Industrial production; Manufacturing; Material removal rate (machining); Mathematical models; Mechanical Engineering; Media Management; Model accuracy; Original Article; Prediction models; Process parameters; Sawing; Scratching; Silicon substrates; Silicon wafers; Surface properties; Wafers; Wire; Photovoltaic silicon wafer; Sawing force; Wire bow; Diamond wire sawing; Process parameters
• ISSN: 0268-3768; 1433-3015
• DOI: 10.1007/s00170-023-12659-5

In the diamond wire sawing (DWS), the wire bow provides cutting force, reflecting the cutting ability and the saw wire cutting state, which is one of the important issues that need to be paid attention to in industrial production. Selecting the appropriate wire bow in the sawing process can not only improve the surface quality of the wafers, but also reduce the probability of breakage. Therefore, the prediction of the wire bow is of great significance for improving the yield of the wafers and reducing the wear of the diamond wire. In this paper, the force analysis of the wire bow formed by the sawing process is carried out, and the relationship between the cutting force and the material removal rate is obtained from the microscopic abrasive scratching process. The wire bow prediction model of diamond wire sawing based on process parameters is founded, and the accuracy of the model is verified by experiments. The established model is used to analyze the influence of process parameters on the wire bow in the current solar photovoltaic silicon cell substrate cutting, which provides guiding significance for diamond wire sawing production.