The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies

The effects of reflow parameter values on the microstructure of SnAgCu/SnBiAg mixed assemblies were examined. The variation of the volume fraction of the hypoeutectic SnBiAg phase with respect to the peak temperature during reflow, and the initial volumes of the SnAgCu and SnBiAg phases, was charact...

Full description

Saved in:
Bibliographic Details
Published inJournal of electronic materials Vol. 50; no. 1; pp. 209 - 216
Main Authors Genanu, Mohammed, Hadian, Faramarz, Owen, Randy, Cotts, Eric J.
Format Journal Article
LanguageEnglish
Published New York Springer US 2021
Springer Nature B.V
Subjects
Assemblies
Characterization and Evaluation of Materials
Chemistry and Materials Science
Concentration gradient
Electronics and Microelectronics
Heat treating
Instrumentation
Materials Science
Microstructure
Optical and Electronic Materials
Solid State Physics
Tin base alloys
SnBi-based solder
diffusion
mixed assemblies
Microstructure interconnects
Online AccessGet full text

Cover

More Information
Summary:The effects of reflow parameter values on the microstructure of SnAgCu/SnBiAg mixed assemblies were examined. The variation of the volume fraction of the hypoeutectic SnBiAg phase with respect to the peak temperature during reflow, and the initial volumes of the SnAgCu and SnBiAg phases, was characterized. A simple theory was developed to predict the volume of the SnAgCu and SnBiAg phases after reflow, as a function of the peak temperature during reflow and the initial volume of the SnBiAg phase. This theory was based upon a one-dimensional Sn/eutectic SnBi mixed assembly. Concentration gradients in the hypoeutectic SnBiAg phase after reflow were characterized and compared to results from the Scheil equation.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-020-08474-3