Maintaining the localized surface plasmon resonance of copper nanoparticles by defective TiO2 thin films

The localized surface plasmon resonance (LSPR) of copper nanoparticles (CuNPs) damps quickly in air due to the easy oxidation of copper atoms. Finding ways to retard the oxidation of CuNPs is critical for the applications based on the LSPR of CuNPs. In this paper, we report on a new method to mainta...

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Bibliographic Details
Published inApplied physics. A, Materials science & processing Vol. 127; no. 12
Main Authors Zhao, Shiqi, Cheng, Zhitao, Wang, Shuai, Hao, Hongliang, Fang, Yingcui
Format Journal Article
LanguageEnglish
Published Berlin/Heidelberg Springer Berlin Heidelberg 01.12.2021
Springer Nature B.V
Subjects
Applied physics
Characterization and Evaluation of Materials
Condensed Matter Physics
Copper
Machines
Manufacturing
Materials science
Nanoparticles
Nanotechnology
Optical and Electronic Materials
Oxidation
Physics
Physics and Astronomy
Processes
Rapid Communications
Surface plasmon resonance
Surfaces and Interfaces
Thin Films
Titanium dioxide
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Summary:The localized surface plasmon resonance (LSPR) of copper nanoparticles (CuNPs) damps quickly in air due to the easy oxidation of copper atoms. Finding ways to retard the oxidation of CuNPs is critical for the applications based on the LSPR of CuNPs. In this paper, we report on a new method to maintaining the LSPR of CuNPs by deposition of CuNPs on TiO 2 thin films in vacuum followed by annealing in nitrogen ambient. The anti-oxidation properties of the CuNPs were improved greatly. In three days, the LSPR intensities at 532 and 633 nm were reduced by only 40 and 32%, respectively. This method is simple and cost-effective.
ISSN:0947-8396
1432-0630
DOI:10.1007/s00339-021-05073-9