Interfacial microstructure of anodic-bonded Al/glass

• Published in: Journal of materials science. Materials in electronics Vol. 13; no. 2; pp. 83 - 88
• Main Authors: XING QINGFENG, SASAKI, G, FUKUNAGA, H
• Format: Journal Article
• Language: English
• Published: Norwell, MA Springer 01.02.2002; Springer Nature B.V
• Subjects: Aluminum; Aluminum oxide; Bonding; Condensed matter: structure, mechanical and thermal properties; Crystal structure; Diffusion; Diffusion welding; Exact sciences and technology; Glass; Interface structure and roughness; Microstructure; Physics; Solid surfaces and solid-solid interfaces; Studies; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Interface structure; Aluminium; Microstructure; Bonding; Scattering; Glass
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1023/A:1013650123007

The interfacial microstructure of anodic-bonded Al/glass was investigated to obtain a better understanding of the bonding process. The experimental results demonstrate that a sodium-depleted region existed in the glass adjacent to the aluminum. Aluminum diffused into the glass for about 500 nm when the Al/glass was anodic-bonded at 250 °C, 700 V and 420 s. Furthermore, a crystalline region about 10 nm thick developed in this aluminum-diffused region of the glass. The crystalline region was greatly aluminum-diffused. No aluminum oxide region existed at the interface. It is therefore concluded that the diffusion of aluminum into the glass is responsible for bond formation. This conclusion does not agree with the conventional anode oxidation model based on the assumption that aluminum does not diffuse into the glass.[PUBLICATION ABSTRACT]