Structural, electrical properties of bismuth and niobium-doped LaNiO3 perovskite obtained by sol–gel route for future electronic device applications

This paper discusses the structural, microstructure and electrical properties of perovskite oxide lanthanum nickel LaNiO 3 , synthesized by the sol–gel reaction technique that was investigated. The prepared material was doped with bismuth and niobium and studied their properties. The Rietveld refine...

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Published inIndian journal of physics Vol. 98; no. 8; pp. 2745 - 2753
Main Authors Nassar, Kais Iben, Benamara, M., Kechiche, L., Teixeira, S. Soreto, Graça, M. P. F.
Format Journal Article
LanguageEnglish
Published New Delhi Springer India 01.07.2024
Springer Nature B.V
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Summary:This paper discusses the structural, microstructure and electrical properties of perovskite oxide lanthanum nickel LaNiO 3 , synthesized by the sol–gel reaction technique that was investigated. The prepared material was doped with bismuth and niobium and studied their properties. The Rietveld refinement of the X-ray diffraction pattern suggests that the compound has a monoclinic phase at room temperature with a P 2 1 / n space group. Scanning electron microscopy surface morphology analysis of the sample showed closed packing of grains with good density and very little porosity. The frequency-dependent modulus of the material is investigated in the temperature range from 200 K to 360 K and in range frequency between 1 kHz and 1 MHz. The Cole–Cole model is used to analyze the dielectric relaxation phenomenon. The complex impedance data are analyzed by an electrical equivalent circuit consisting of a resistance and a constant phase element, where the ideal capacitance part is replaced by a constant phase element. The frequency-dependent conductivity spectra follow the Jonscher power law. Nevertheless, the Arrhenius-type conduction mechanism was found to be active in the sample with activation energy of 0.168 eV. The electrical property of the sample was found to be independent of temperatures, making it a potential candidate for thermally stable capacitor application.
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ISSN:0973-1458
0974-9845
DOI:10.1007/s12648-023-03039-6