Review of Silicon Carbide Power Devices and Their Applications
Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and...
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Published in | IEEE transactions on industrial electronics (1982) Vol. 64; no. 10; pp. 8193 - 8205 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.10.2017
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Abstract | Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper. |
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AbstractList | Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper. Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon, SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. Our paper reviews the technology progress of SiC power devices and their emerging applications. Furthemore, the design challenges and future trends are summarized at the end of the paper. |
Author | Ozpineci, Burak Lucia, Oscar Huang, Alex Q. Xu She |
Author_xml | – sequence: 1 surname: Xu She fullname: Xu She email: xshe@ieee.org organization: Electr. Power, GE Global Res., Niskayuna, NY, USA – sequence: 2 givenname: Alex Q. surname: Huang fullname: Huang, Alex Q. email: aqhuang@ncsu.edu organization: North Carolina State Univ., Raleigh, NC, USA – sequence: 3 givenname: Oscar surname: Lucia fullname: Lucia, Oscar email: olucia@ieee.org organization: Electron. Eng. & Commun., Univ. of Zaragoza, Zaragoza, Spain – sequence: 4 givenname: Burak surname: Ozpineci fullname: Ozpineci, Burak email: burak@ornl.gov organization: Oak Ridge Nat. Lab., Univ. of Tennessee, Knoxville, TN, USA |
BackLink | https://www.osti.gov/biblio/1394186$$D View this record in Osti.gov |
BookMark | eNp9kE1Lw0AQhhepYFu9C16CnlN3kv1ILkKp9QMKitbzkmwmdEvNxt3U4r93a4oHD57mMM_7MvOMyKCxDRJyDnQCQPPr5eN8klCQk0TwhFE4IkPgXMZ5zrIBGdJEZjGlTJyQkfdrSoFx4ENy84KfBneRraNXszHaNtGscKWpMHq2O3TRbdhr9FHRVNFyhcZF07YNYNEZ2_hTclwXG49nhzkmb3fz5ewhXjzdP86mi1inkHVxBlzWrBRIS46igBRZyqsko0xCSauqBJbrsmRM51UltATN80zoEjgykfA8HZPLvtf6ziivTYd6FY5tUHcK0pxBJgJ01UOtsx9b9J1a261rwl0qAckY5RL2VaKntLPeO6xVaPv5pnOF2Sigai9UBaFqL1QdhIYg_RNsnXkv3Nd_kYs-YhDxF5dBRwpJ-g3gvYAU |
CODEN | ITIED6 |
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ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2017 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2017 |
CorporateAuthor | Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States) |
CorporateAuthor_xml | – name: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States) |
DBID | 97E RIA RIE AAYXX CITATION 7SP 8FD L7M OTOTI |
DOI | 10.1109/TIE.2017.2652401 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace OSTI.GOV |
DatabaseTitle | CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
DatabaseTitleList | Technology Research Database |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Xplore url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1557-9948 |
EndPage | 8205 |
ExternalDocumentID | 1394186 10_1109_TIE_2017_2652401 7815312 |
Genre | orig-research |
GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E 9M8 AAJGR AARMG AASAJ AAWTH ABAZT ABQJQ ABVLG ACGFO ACGFS ACIWK ACKIV ACNCT AENEX AETIX AGQYO AGSQL AHBIQ AI. AIBXA AKJIK AKQYR ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ H~9 IBMZZ ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 MS~ O9- OCL P2P RIA RIE RNS TAE TN5 TWZ VH1 VJK AAYXX CITATION RIG 7SP 8FD L7M ABPTK OTOTI |
ID | FETCH-LOGICAL-c318t-8157f4b6e0b5e6a13e435d280471b0ddb149cbb44c9dd6c71c5986cb15e462593 |
IEDL.DBID | RIE |
ISSN | 0278-0046 |
IngestDate | Thu May 18 18:33:23 EDT 2023 Mon Jun 30 10:24:23 EDT 2025 Tue Jul 01 00:16:19 EDT 2025 Thu Apr 24 23:01:41 EDT 2025 Tue Aug 26 16:43:25 EDT 2025 |
IsDoiOpenAccess | false |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 10 |
Language | English |
License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-029 https://doi.org/10.15223/policy-037 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c318t-8157f4b6e0b5e6a13e435d280471b0ddb149cbb44c9dd6c71c5986cb15e462593 |
Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 USDOE AC05-00OR22725 |
ORCID | 0000000216723348 |
PQID | 2174405719 |
PQPubID | 85464 |
PageCount | 13 |
ParticipantIDs | proquest_journals_2174405719 osti_scitechconnect_1394186 ieee_primary_7815312 crossref_citationtrail_10_1109_TIE_2017_2652401 crossref_primary_10_1109_TIE_2017_2652401 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2017-10-01 |
PublicationDateYYYYMMDD | 2017-10-01 |
PublicationDate_xml | – month: 10 year: 2017 text: 2017-10-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York – name: United States |
PublicationTitle | IEEE transactions on industrial electronics (1982) |
PublicationTitleAbbrev | TIE |
PublicationYear | 2017 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
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SSID | ssj0014515 |
Score | 2.696394 |
Snippet | Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to... |
SourceID | osti proquest crossref ieee |
SourceType | Open Access Repository Aggregation Database Enrichment Source Index Database Publisher |
StartPage | 8193 |
SubjectTerms | Electronic devices Junctions MATERIALS SCIENCE MOSFET PIN photodiodes Power converter power device review Schottky diodes Silicon Silicon carbide silicon carbide (SiC) |
Title | Review of Silicon Carbide Power Devices and Their Applications |
URI | https://ieeexplore.ieee.org/document/7815312 https://www.proquest.com/docview/2174405719 https://www.osti.gov/biblio/1394186 |
Volume | 64 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8NAEB5qT3rwVcX6Yg9eBNPmuclehFIVFSqCFbwt3d0JiJKKphd_vTNJWnwhnpLDJllmdna-ycx-A3Dk8sz6oQk8K03uxTJynkKFXmRSJAPx7aQiSRrdyMv7-PoheWjByeIsDCJWxWfY49sql--mdsa_yvppRvbJLYWXKHCrz2otMgZxUncrCJkxloK-eUrSV_3x1TnXcKW9UCbkwIIvLqjqqUKXKVnUj_24cjIXazCaT6-uLXnqzUrTs-_fmBv_O_91WG3QphjUy2MDWlhswsonDsIOnNbZATHNxd3jM62LQgwnr-bRobjlDmriDKvNREwKJ8acVhCDT0nvLbi_OB8PL72mqYJnyXxLj6aQ5rGR6JsE5SSIkACTCzOfvJTxnTMUMllj4tgq56RNA8sM7tYECcYcK0Xb0C6mBe6AQIImShKEUCGhLorc0DmV28BEGXl9a7rQn8tZ24ZxnBtfPOsq8vCVJs1o1oxuNNOF48UTLzXbxh9jOyzhxbhGuF3YY1VqAhDMgmu5XMiWmoBuHGSyC_tzDevGWN80R2WMWwO1-_s792CZv1zX8O1Du3yd4QFhkdIcVovwA4NS17I |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwzV1Lb9QwEB6V9gAceBXE0hZ8aA8cshs7iRMfQKr60C59CImt1JtZ2xOposqiNisEv4W_wn9jJsmu-kC9VeKUHGIr8cx4vsmMvwHYDGXhY-Vk5LUro1QnITJoMEpcjmQgsZ80JElHx3p4kn46zU6X4PfiLAwiNsVn2OfbJpcfpn7Gv8oGeUH2KVVXQnmAP39QgHb5YbRL0txSan9vvDOMuh4CkSdtrSMakZep0xi7DPVEJkj4IKgipk3ZxSE4ihC8c2nqTQja59IzYbl3MsOUQ4OE5n0AK4QzMtWeDlvkKNKs7Y-gmKOWwsx5EjQ2g_Foj6vG8r7SGblMec3pNV1c6DIlG77lARq3tv8U_swXpK1m-daf1a7vf93givxfV-wZPOnwtNhuDeA5LGH1Ah5fYVlchY9t_kNMS_Hl7Jw0vxI7kwt3FlB85h5xYheb7VJMqiDGnDgR21fS-i_h5F4-4BUsV9MKX4NAAl9GE0gyinAlxaYYgim9dElBuMa7HgzmcrW-41Tn1h7ntomtYmNJEyxrgu00oQfvFyO-t3widzy7yhJdPNcJswdrrDqWIBLz_HouiPK1JSifykL3YH2uUbbbji4tx52MzKV58-8538HD4fjo0B6Ojg_W4BG_RVuxuA7L9cUMNwh51e5tYwACvt63_vwFZXU0XA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Review+of+Silicon+Carbide+Power+Devices+and+Their+Applications&rft.jtitle=IEEE+transactions+on+industrial+electronics+%281982%29&rft.au=Xu+She&rft.au=Huang%2C+Alex+Q.&rft.au=Lucia%2C+Oscar&rft.au=Ozpineci%2C+Burak&rft.date=2017-10-01&rft.pub=IEEE&rft.issn=0278-0046&rft.volume=64&rft.issue=10&rft.spage=8193&rft.epage=8205&rft_id=info:doi/10.1109%2FTIE.2017.2652401&rft.externalDocID=7815312 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0278-0046&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0278-0046&client=summon |
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