Fiber-array pigtailing and packaging of an InP-based optical cross-connect chip

A method of coupling six single-mode fiber tapers with 250-/spl mu/m spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient...

Full description

Saved in:
Bibliographic Details
Published inIEEE journal of selected topics in quantum electronics Vol. 5; no. 5; pp. 1255 - 1259
Main Authors van Zantvoort, J.H.C., Huijskens, F.M., Herben, G.P., de Waardt, H.
Format Journal Article
LanguageEnglish
Published IEEE 01.09.1999
Subjects
Optical coupling
Optical fiber polarization
Optical fiber testing
Optical fibers
Optical interferometry
Optical planar waveguides
Optical refraction
Optical variables control
Optical waveguides
Packaging
Online AccessGet full text

Cover

More Information
Summary:A method of coupling six single-mode fiber tapers with 250-/spl mu/m spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5/spl deg/C to 45/spl deg/C.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1077-260X
1558-4542
DOI:10.1109/2944.806749