Thermal and mechanical properties of carbon fiber-reinforced resin composites with copper/boron nitride coating

Copper and hexagonal boron nitride filler (Cu/hBN) were incorporated into carbon fiber-reinforced polymer (CFRP) composites by electrophoretic deposition (EPD) to maximize their thermal conductivity. The results show that the thermal conductivity increased to 1.68 and 5.15 W/mK in the through-thickn...

Full description

Saved in:
Bibliographic Details
Published inComposite structures Vol. 220; pp. 494 - 501
Main Authors Zheng, Xiru, Park, Chan Woo
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 15.07.2019
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Copper and hexagonal boron nitride filler (Cu/hBN) were incorporated into carbon fiber-reinforced polymer (CFRP) composites by electrophoretic deposition (EPD) to maximize their thermal conductivity. The results show that the thermal conductivity increased to 1.68 and 5.15 W/mK in the through-thickness and in-plane directions, respectively, when the concentration of hBN particles in the deposition solution was increased to 5 g/L. Moreover, the interlaminar shear strength results of various composites exhibited the same trend as the thermal conductivity. However, the tensile test results showed that the tensile strength was reduced as the hBN concentration was increased.
ISSN:0263-8223
1879-1085
DOI:10.1016/j.compstruct.2019.03.089