Relationship between deposition and recrystallization textures of copper and chromium electrodeposits

• Published in: Journal of materials science Vol. 35; no. 16; pp. 4055 - 4066
• Main Authors: Choi, Joon Hwan, Soo Young Kang, Lee, Dong Nyung
• Format: Journal Article
• Language: English
• Published: Heidelberg Springer 01.08.2000; Springer Nature B.V
• Subjects: Applied sciences; Chromium; Condensed matter: structure, mechanical and thermal properties; Copper; Cross-disciplinary physics: materials science; rheology; Dislocations; Exact sciences and technology; Liquid phase epitaxy; deposition from liquid phases (melts, solutions, and surface layers on liquids); Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Modulus of elasticity; Physics; Recrystallization; Residual stress; Structure and morphology; thickness; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology; Transition elements; Recrystallization; Chromium; Crystal growth from solutions; Electrodeposition; XRD; Copper; Experimental study; Thermal annealing; TEM; Texture
• ISSN: 0022-2461; 1573-4803
• DOI: 10.1023/A:1004834204320

The 〈100〉, 〈111〉 and 〈110〉 textures of copper electrodeposits obtained from copper sulfate baths changed to the 〈100〉, 〈100〉 and 〈〉 textures, respectively, after recrystallization. The textures of chromium electrodeposits obtained from the standard Sargent bath remained unchanged after recrystallization. The results are in agreement with the prediction of the strain energy release maximization model, in which the recrystallized grains orient themselves so that their minimum elastic modulus direction can be parallel to the absolute maximum internal stress direction due to dislocations in the non-recrystallized grains.