Effect of Oxygen Inhibition Layer of Universal Adhesives on Enamel Bond Fatigue Durability and Interfacial Characteristics With Different Etching Modes

• Published in: Operative dentistry Vol. 42; no. 6; p. 636
• Main Authors: Ouchi, H, Tsujimoto, A, Nojiri, K, Hirai, K, Takamizawa, T, Barkmeier, W W, Latta, M A, Miyazaki, M
• Format: Journal Article
• Language: English
• Published: United States 01.11.2017
• Subjects: Dental Bonding - methods; Dental Cements - adverse effects; Dental Cements - therapeutic use; Dental Enamel - metabolism; Dental Etching - methods; Dental Stress Analysis; Humans; Oxygen - metabolism
• ISSN: 1559-2863
• DOI: 10.2341/16-255-L

The purpose of this study was to evaluate the effect of the oxygen inhibition layer of universal adhesive on enamel bond fatigue durability and interfacial characteristics with different etching modes. The three universal adhesives used were Scotchbond Universal Adhesive (3M ESPE, St Paul, MN, USA), Adhese Universal (Ivoclar Vivadent, Schaan, Lichtenstein), and G-Premio Bond (GC, Tokyo, Japan). The initial shear bond strength and shear fatigue strength to enamel was determined in the presence and absence of the oxygen inhibition layer, with and without phosphoric acid pre-etching. The water contact angle was also measured in all groups using the sessile drop method. The enamel bonding specimens with an oxygen inhibition layer showed significantly higher (p<0.05) initial shear bond strengths and shear fatigue strengths than those without, regardless of the adhesive type and etching mode. Moreover, the water contact angles on the specimens with an oxygen inhibition layer were significantly lower (p<0.05) than on those without, regardless of etching mode. The results of this study suggest that the oxygen inhibition layer of universal adhesives significantly increases the enamel bond fatigue durability and greatly changes interfacial characteristics, suggesting that the bond fatigue durability and interfacial characteristics of these adhesives strongly rely on its presence.