Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath

Room temperature softening of copper film electrodeposited from ethylenediamine complex baths was investigated along with its mechanism. The bright copper film electrodeposited from baths containing a small quantity of thiodiglycollic acid were of small crystallite size and contained small amounts o...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 44; no. 8; pp. 687 - 691
Main Authors MIZUMOTO, Shozo, NAWAFUNE, Hidemi, HIROO, Takao, HAGA, Masaki
Format Journal Article
LanguageEnglish
Japanese
Published Tokyo The Surface Finishing Society of Japan 01.08.1993
Hyomen Gijutsu Kyokai
Japan Science and Technology Agency
Subjects
Copper Electrodeposition
Crystal Structure
Ethylenediamine Bath
Recrystallization
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Summary:Room temperature softening of copper film electrodeposited from ethylenediamine complex baths was investigated along with its mechanism. The bright copper film electrodeposited from baths containing a small quantity of thiodiglycollic acid were of small crystallite size and contained small amounts of impurities. The films obtained were found to increase in crystallite size, decrease in microhardness and undergo orientation transformations into closed packed facet of the fcc lattice, resulting in a first recrystallization at room temperature.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.44.687