Very‐Low‐Temperature Integrated Complementary Graphene‐Barristor‐Based Inverter for Thin‐Film Transistor Applications
Complementary graphene‐barristor‐based inverters using n‐type ZnO:N and p‐type dinaphtho‐[2,3‐b:2′,3′‐f]thieno[3,2‐b]thiophene semiconductor layers are fabricated at a maximum process temperature lower than 200 °C. The devices display on/off ratios greater than 104. The transmittance of the device s...
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Published in | Annalen der Physik Vol. 530; no. 10 |
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Main Authors | , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Weinheim
Wiley Subscription Services, Inc
01.10.2018
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Subjects | |
Online Access | Get full text |
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Summary: | Complementary graphene‐barristor‐based inverters using n‐type ZnO:N and p‐type dinaphtho‐[2,3‐b:2′,3′‐f]thieno[3,2‐b]thiophene semiconductor layers are fabricated at a maximum process temperature lower than 200 °C. The devices display on/off ratios greater than 104. The transmittance of the device stack is higher than 80% at wavelengths larger than 470 nm. The complementary graphene‐barristor inverter exhibits a high gain (>8 at VDD = 2 V) by using a back‐gate structure, which allows for aggressive gate‐dielectric scaling. The potential performance of the inverter, as projected using experimental device parameters, shows that a very high voltage gain of over 70 and a low switching power consumption of below 10 nW can be achieved at VDD = 2 V and an equivalent oxide thickness of 1 nm. These performances are very promising for thin‐film transistor applications.
The feasibility of complementary graphene‐barristor‐based inverters fabricated on a transparent substrate for thin‐film transistor applications is examined. The inverter function is demonstrated with a high gain over 8. The maximum process temperature for the entire device fabrication is lower than 200 °C. These properties are competitive when compared with those of other devices being investigated for future display‐driver circuit applications. |
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ISSN: | 0003-3804 1521-3889 |
DOI: | 10.1002/andp.201800224 |