A self-adaptive thermal switch array for rapid temperature stabilization under various thermal power inputs

• Published in: Journal of micromechanics and microengineering Vol. 21; no. 8; pp. 85018 - 9
• Main Authors: XIAOBAO GENG, PATEL, Pragnesh, NARAIN, Amitabh, MENG, Dennis Desheng
• Format: Journal Article
• Language: English
• Published: Bristol Institute of Physics 01.08.2011
• Subjects: Arrays; Devices; Droplets; Electric power generation; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical instruments, equipment and techniques; Microelectromechanical systems; Micromechanical devices and systems; Optimization; Physics; Stabilization; Switches; Stabilization; Droplets; Modelling; Temperature control; Experimental study; Heat sinks; Adaptive method; Microelectromechanical device; Low melting point alloy
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/21/8/085018

A self-adaptive tliennal switch anay (TSA) based on actuation by low-melting-point alloy droplets is reported to stabilize the temperature of a heat-generating microelectromechanical system (MEMS) device at a predetermined range (i.e. the optimal working temperature of the device) with neither a control circuit nor electrical power consumption. When the temperature is below this range, the TSA stays off and works as a tliennal insulator. Therefore, the MEMS device can quickly heat itself up to its optimal working temperature during startup. Once this temperature is reached, TSA is automatically turned on to increase the tliennal conductance, working as an effective tliennal spreader. As a result, the MEMS device tends to stay at its optimal working temperature without complex tliennal management components and the associated parasitic power loss. A prototype TSA was fabricated and characterized to prove tlie concept. The stabilization temperatures under various power inputs have been studied both experimentally and theoretically. Under the increment of power input from 3.8 to 5.8 W, the temperature of the device increased only by 2.5 [degrees]C due to the stabilization effect of TSA.