Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE

A series of novel poly(amide-imide) (PAI) films with different amide contents were prepared from pyromellitic dianhydride and four amide-containing diamines. These PAI films exhibited excellent mechanical and thermal properties with tensile strength of 203.7–297.4 MPa and T g above 407 °C. The rigid...

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Bibliographic Details
Published inChinese journal of polymer science Vol. 38; no. 7; pp. 748 - 758
Main Authors Bai, Lan, Zhai, Lei, He, Min-Hui, Wang, Chang-Ou, Mo, Song, Fan, Lin
Format Journal Article
LanguageEnglish
Published Beijing Chinese Chemical Society and Institute of Chemistry, CAS 01.07.2020
Springer Nature B.V
Subjects
Agglomeration
Characterization and Evaluation of Materials
Chemical bonds
Chemistry
Chemistry and Materials Science
Condensed Matter Physics
Diamines
Dianhydrides
High temperature
Hydrogen bonding
Industrial Chemistry/Chemical Engineering
Molecular chains
Optoelectronics
Polymer Sciences
Substrates
Tensile strength
Thermal expansion
Thermodynamic properties
Poly(amide-imide)s
Aggregation structures
Thermal expansion behavior
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Summary:A series of novel poly(amide-imide) (PAI) films with different amide contents were prepared from pyromellitic dianhydride and four amide-containing diamines. These PAI films exhibited excellent mechanical and thermal properties with tensile strength of 203.7–297.4 MPa and T g above 407 °C. The rigid backbone structures combined with strong intermolecular interactions provided PAI films with ultralow in-plane CTE values from −4.17 ppm/°C to −0.39 ppm/°C in the temperature range of 30–300 °C. The correlation between thermal expansion behavior and aggregation structures of PAI film was investigated. The results suggested that hydrogen bonding interactions could be maintained even at high temperature, thus resulting in good dimension reversibility of films in multiple heating-cooling cycles. It is demonstrated that dimensional stabilities of PAI films are determined by the rigidity, orientation, and packing of molecular chains. Heat-resistant PAI films with ultralow CTE can be developed as flexible substrates by regulating backbones and aggregation structures for optoelectronic application.
ISSN:0256-7679
1439-6203
DOI:10.1007/s10118-020-2366-1