Compressive elastic behavior of single-crystalline 4H-silicon carbide (SiC) nanopillars

• Published in: Science China. Technological sciences Vol. 64; no. 1; pp. 37 - 43
• Main Authors: Fan, SuFeng, Li, XiaoCui, Fan, Rong, Lu, Yang
• Format: Journal Article
• Language: English
• Published: Beijing Science China Press 2021; Springer Nature B.V
• Subjects: Compression tests; Compressive strength; Crystal structure; Elasticity; Electric vehicles; Electron mobility; Engineering; Mechanical properties; Microelectromechanical systems; Nanocomposites; Optoelectronics; Room temperature; Silicon carbide; Single crystals; Strain; Wide bandgap semiconductors; elastic deformation; compressive behavior; in situ SEM/TEM; elastic strain engineering; silicon carbide
• ISSN: 1674-7321; 1869-1900
• DOI: 10.1007/s11431-020-1678-6

As a wide-bandgap semiconductor, 4H-SiC is an ideal material for high-power and high-frequency devices, and plays an increasingly important role in developing our country’s future electric vehicles and 5G techniques. Practical applications of SiC-based devices largely depend on their mechanical performance and reliability at the micro- and nanoscales. In this paper, single-crystal [0001]-oriented 4H-SiC nanopillars with the diameter ranging from ~200 to 700 nm were microfabricated and then characterized by in situ nanomechanical testing under SEM/TEM at room temperature. Loading-unloading compression tests were performed, and large, fully reversible elastic strain up to ~6.2% was found in nanosized pillars. Brittle fracture still occurred when the max strain reached ~7%, with corresponding compressive strength above 30 GPa, while in situ TEM observation showed few dislocations activated during compression along the [0001] direction. Besides robust microelectromechanical system (MEMS), flexible device and nanocomposite applications, the obtained large elasticity in [0001]-oriented 4H-SiC nanopillars can offer a fertile opportunity to modulate their electron mobility and bandgap structure by nanomechanical straining, the so called “elastic strain engineering”, for novel electronic and optoelectronic applications.