Improving surface smoothness of laser-fabricated microchannels for microfluidic application

Inexpensive and flexible CO sub(2) laser rapid prototyping of polymer microfluidics is facing challenges due to the rough microchannel surface typically with a roughness Ra in the mu m range produced directly through laser ablation. In this study, a wet chemical etching technique was developed and u...

Full description

Saved in:
Bibliographic Details
Published inJournal of micromechanics and microengineering Vol. 21; no. 9; pp. 95008 - 8
Main Authors WANG, Z. K, ZHENG, H. Y, LIM, R. Y. H, WANG, Z. F, LAM, Y. C
Format Journal Article
LanguageEnglish
Published Bristol Institute of Physics 01.09.2011
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Inexpensive and flexible CO sub(2) laser rapid prototyping of polymer microfluidics is facing challenges due to the rough microchannel surface typically with a roughness Ra in the mu m range produced directly through laser ablation. In this study, a wet chemical etching technique was developed and used successfully to carry out smoothing of microchannel surfaces fabricated on a polymethyl methacrylate substrate using CO sub(2) laser direct writing. The microchannel surface roughness of a few mu m was significantly reduced through etching in acetone diluted with ethanol in an ultrasonic bath in a short time cycle. The surface roughness Ra of below 10 nm could be achieved through etching in the heated etchant solution while without noted deformation in a microchannel structure. The mechanism to reduce surface roughness by the tunable solubility of a polymer in a liquid through concentration and temperature control is discussed with respect to the effect of the etching parameters: acetone concentration, etching time and the temperature of the etching solution. The results would be attractive for microfluidic chip applications when using laser prototyping.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/21/9/095008