Spark plasma sintering technique: an alternative method to enhance ZT values of Sb doped Cu2SnSe3

Sb doped Cu 2 Sn 1− x Sb x Se 3 (0 ≤  x  ≤ 0.04) compounds have been fabricated by spark plasma sintering technique for the investigation of their thermoelelctric properties in the temperature range 10–400 K. The conduction mechanism of electrical resistivity reveals that small polaron hopping model...

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Published inJournal of materials science. Materials in electronics Vol. 29; no. 15; pp. 13200 - 13208
Main Authors Prasad, K. Shyam, Rao, Ashok, Bhardwaj, Ruchi, Johri, Kishor Kumar, Chang, Chia-Chi, Kuo, Yung-Kang
Format Journal Article
LanguageEnglish
Published New York Springer US 01.08.2018
Springer Nature B.V
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Summary:Sb doped Cu 2 Sn 1− x Sb x Se 3 (0 ≤  x  ≤ 0.04) compounds have been fabricated by spark plasma sintering technique for the investigation of their thermoelelctric properties in the temperature range 10–400 K. The conduction mechanism of electrical resistivity reveals that small polaron hopping model is valid in the high-temperature regime and variable range hopping model in low-temperature regime. The positive values of Seebeck coefficient ( S ) for Cu 2 Sn 1− x Sb x Se 3 (0 ≤  x  ≤ 0.04) samples in the entire temperature range indicates that the majority charge carriers are holes. The electronic thermal conductivity ( κ e ) was estimated by Wiedmann-Franz law and found that the contribution of κ e to the total κ is < 1%, suggesting that the heat conduction for presently studied Cu 2 Sn 1− x Sb x Se 3 (0 ≤  x  ≤ 0.04) samples is mainly associated to the lattice phonons. The highest ZT value for the Cu 2 Sn 0.96 Sb 0.04 Se 3 sample was 0.044 at 400 K, which is approximately four times that of the Cu 2 SnSe 3 sample and an order of magnitude larger than the samples prepared by the conventional solid-state method. Also, the thermoelectric compatibility factor of Cu 2 Sn 0.96 Sb 0.04 Se 3 was found to be about 1 per V.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-018-9444-y