Study of Electroplated Nickel Layer Thickness and Saw Parameters on Cutting Performance in Diamond Wire Sawing of Sapphire Ingots

• Published in: Key Engineering Materials Vol. 656-657; pp. 450 - 455
• Main Authors: Lee, Cheng Kuo, Yeh, Rong Hwei, Tan, A.H., Chen, H.Y.
• Format: Journal Article
• Language: English
• Published: Zurich Trans Tech Publications Ltd 23.07.2015
• Subjects: Cutting speed; Diamond machining; Ingots; Nickel; Sapphire; Sawing; Thickness; Wire; Saw Parameters; Diamond Wire Sawing; Sapphire; Nickel Layer
• ISBN: 3038354953; 9783038354956
• ISSN: 1013-9826; 1662-9795; 1662-9795
• DOI: 10.4028/www.scientific.net/KEM.656-657.450

A production-scale multiwire saw machine and 4 inch sapphire ingots were used in this study. The diamond wire used in the study had a core diameter of 0.1mm with an attached diamond particle size of 8–12μm. This study uses the Taguchi method and Grey relational analysis on the key diamond wire parameters which are electroplated nickel layer thickness, diamond wire tension, diamond wire speed and sapphire ingot feed rate, in order to simultaneously optimize the cutting performance in the diamond wire sawing of sapphire ingots. Based on the analysis, the nickel layer thickness and wire speed are the first and second most significant factors with 31.7 and 29.9% effects on cutting performances. The optimal control factors were then simultaneously evaluated for Ra, material removal rate, diamond wire wear rate and TTV and were found at optimization to be 14 μm nickel layer thickness, 15NT wire tension, 800m/min wire speed and 0.2mm/min feed rate, respectively. Compared with current standard condition, this improved process obtained from the optimization of diamond wire electroplated nickel layer thickness and saw machine parameters in the diamond wire sawing of sapphire ingots can achieve a 33% lower Ra, a 20% lower diamond wear rate, a 13% lower TTV and a 20% higher material removal rate, simultaneously.