Low specific contact resistance on epitaxial p-type 4H-SiC with a step-bunching surface

This paper reports the performances of Ti/Al based ohmic contacts fabricated on highly doped p-type 4H-SiC epitaxial layer which has a severe step-bunching surface. Different contact schemes are investigated based on the AI：Ti composition with no more than 50 at.% Al. The specific contact resistance...

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Bibliographic Details
Published inChinese physics B Vol. 24; no. 11; pp. 452 - 459
Main Author 韩超 张玉明 宋庆文 汤晓燕 张义门 郭辉 王悦湖
Format Journal Article
LanguageEnglish
Published 01.11.2015
Subjects
4H-SiC
Aluminum
Annealing
Contact
Contact resistance
Intermetallic compounds
Ohmic
Surface layer
Texture
Ti3SiC2
Titanium
显微结构分析
欧姆接触
比接触电阻
聚束
表面制备
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Summary:This paper reports the performances of Ti/Al based ohmic contacts fabricated on highly doped p-type 4H-SiC epitaxial layer which has a severe step-bunching surface. Different contact schemes are investigated based on the AI：Ti composition with no more than 50 at.% Al. The specific contact resistance （SCR） is obtained to be as low as 2.6 × 10-6Ωcm2 for the bilayered Ti（100 nm）/Al（100 nm） contact treated with 3 rain rapid thermal annealing （RTA） at 1000 ℃. The microstructure analyses examined by physical and chemical characterization techniques reveal an alloy-assisted ohmic contact formation mechanism, i.e., a high degree of alloying plays a decisive role in forming the interfacial ternary Ti3SiC2 dominating the ohmic behavior of the Ti/Al based contact. Furthermore, a globally covered Ti3 SiC2 layer with （0001）-oriented texture can be formed, regardless of the surface step bunching as well as its structural evolution during the metallization annealing.
Bibliography:This paper reports the performances of Ti/Al based ohmic contacts fabricated on highly doped p-type 4H-SiC epitaxial layer which has a severe step-bunching surface. Different contact schemes are investigated based on the AI：Ti composition with no more than 50 at.% Al. The specific contact resistance （SCR） is obtained to be as low as 2.6 × 10-6Ωcm2 for the bilayered Ti（100 nm）/Al（100 nm） contact treated with 3 rain rapid thermal annealing （RTA） at 1000 ℃. The microstructure analyses examined by physical and chemical characterization techniques reveal an alloy-assisted ohmic contact formation mechanism, i.e., a high degree of alloying plays a decisive role in forming the interfacial ternary Ti3SiC2 dominating the ohmic behavior of the Ti/Al based contact. Furthermore, a globally covered Ti3 SiC2 layer with （0001）-oriented texture can be formed, regardless of the surface step bunching as well as its structural evolution during the metallization annealing.
11-5639/O4
4H-SiC, p-type, ohmic contact, alloying, step bunching
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1674-1056
2058-3834
1741-4199
DOI:10.1088/1674-1056/24/11/117304