Experimental study on high-power LEDs integrated with micro heat pipe

• Published in: Optoelectronics letters Vol. 12; no. 1; pp. 31 - 34
• Main Author: 李聪明 周传鹏 罗怡 Mohammad Hamidnia 王晓东 由博
• Format: Journal Article
• Language: English
• Published: Tianjin Tianjin University of Technology 2016
• Subjects: Lasers; LED器件; Optical Devices; Optics; Photonics; Physics; Physics and Astronomy; Si衬底; 大功率LED; 实验; 微热管; 微电子机械系统; 输入功率; 集成; Light Emit Diode; Proportional Integral Derivative; Filling Ratio; Heat Pipe; Input Power
• ISSN: 1673-1905; 1993-5013
• DOI: 10.1007/s11801-016-5231-2

Micro heat pipe（MHP） is applied to implement the efficient heat transfer of light emitting diode（LED） device.The fabrication of MHP is based on micro-electro-mechanical-system（MEMS） technique,15 micro grooves were etched on one side of silicon（Si） substrate,which was then packaged with aluminum heat sink to form an MHP.On the other side of Si substrate,three LED chips were fixed by die bonding.Then experiments were performed to study the thermal performance of this LED device.The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power,the optimum filling ratio changes from 30% to 48%,and the time reaching stable state is reduced; when the input power is equal to 2.5 W,only the LED device with filling ratio of 48% can work normally.So integrating MHP into high-power LED device can implement the effective control of junction temperature.