Properties of Interfaced Materials and Films: Part I

• Published in: JOM (1989) Vol. 71; no. 10; pp. 3696 - 3697
• Main Authors: Abedrabbo, Sufian M., Fiory, Anthony T., Ravindra, Nuggehalli M.
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.10.2019; Springer Nature B.V
• Subjects: Chemistry/Food Science; Earth Sciences; Energy gap; Engineering; Environment; Evolution; Interfacial stresses; Ion implantation; Materials science; Morphology; Nanotechnology; Oxidation; Physics; Properties of Interfaced Materials and Films; Solid-solid interfaces; Strain; Thin films
• ISSN: 1047-4838; 1543-1851
• DOI: 10.1007/s11837-019-03729-9

Nature plays a significant role in the evolution of surfaces and interfaces in solids. Corrosion of metals is one such example. Interfaces are ubiquitous in almost all engineered materials and devices, and have been known to affect the properties of interfaced materials and films. While the study of solid-solid interfaces represents an important and diverse area of research in materials science and engineering, the understanding and control of interfacial morphology are critical in a number of applications including nanotechnology and energy. Recent advancements in electronics and photonics have led to an evolution in band gap-engineered structures as well as the choice of material candidates. While these structures utilize a variety of semiconductors, interfacial stress becomes an inherent issue. Methods that address interfacial stress and the associated strain as well as the chemistry, thermodynamics and roughness have been illustrated in a number of studies in the literature. In general, processes such as annealing, diffusion, ion implantation, oxidation and thin/thick film deposition techniques/epitaxy are some of the methods that lead to stress/strain in solid-solid interfaces.