A W-band two-stage cascode amplifier with gain of 25.7 dB

AW-bandtwo-stageamplifierMMIChasbeendevelopedusingafullypassivated 2 × 20 μm gate-width and 0.15 μm gate-length InP-based high electron mobility transistor (HEMT) technology. The two-stage amplifier has been realized in combination with a coplanar waveguide technique and cascode topology, thus leadi...

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Published inJournal of semiconductors Vol. 34; no. 12; pp. 72 - 76
Main Author 钟英辉 张玉明 张义门 曹玉雄 姚鸿飞 王显泰 吕红亮 刘新宇 金智
Format Journal Article
LanguageEnglish
Published 01.12.2013
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Online AccessGet full text
ISSN1674-4926
DOI10.1088/1674-4926/34/12/125003

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Summary:AW-bandtwo-stageamplifierMMIChasbeendevelopedusingafullypassivated 2 × 20 μm gate-width and 0.15 μm gate-length InP-based high electron mobility transistor (HEMT) technology. The two-stage amplifier has been realized in combination with a coplanar waveguide technique and cascode topology, thus leading to a compact chip-size of 1.85 × 0.932 mm^2 and an excellent small-signal gain of 25.7 dB at 106 GHz. Additionally, an inter-digital coupling capacitor blocks low-frequency signal, thereby enhancing the stability of the amplifier. The successful design of the two-stage amplifier MMIC indicates that InP HEMT technology has a great potential for W-band applications.
Bibliography:cascode; coplanar waveguide; HEMT; gate-length
11-5781/TN
AW-bandtwo-stageamplifierMMIChasbeendevelopedusingafullypassivated 2 × 20 μm gate-width and 0.15 μm gate-length InP-based high electron mobility transistor (HEMT) technology. The two-stage amplifier has been realized in combination with a coplanar waveguide technique and cascode topology, thus leading to a compact chip-size of 1.85 × 0.932 mm^2 and an excellent small-signal gain of 25.7 dB at 106 GHz. Additionally, an inter-digital coupling capacitor blocks low-frequency signal, thereby enhancing the stability of the amplifier. The successful design of the two-stage amplifier MMIC indicates that InP HEMT technology has a great potential for W-band applications.
Zhong Yinghui, Zhang Yuming, Zhang Yimen, Cao Yuxiong, Yao Hongfei, Wang Xiantai, Lu Hongliang, Liu Xinyu, Jin Zhi(1 School of Microelectronics, Xidian University, Xi'an 710071, China 2 Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China)
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ISSN:1674-4926
DOI:10.1088/1674-4926/34/12/125003