Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module

• Published in: Journal of electronic materials Vol. 40; no. 5; pp. 884 - 888
• Main Authors: Gao, Jun-Ling, Du, Qun-Gui, Zhang, Xiao-Dan, Jiang, Xin-Qiang
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Boston Springer US 01.05.2011; Springer
• Subjects: Applied sciences; Characterization and Evaluation of Materials; Chemistry and Materials Science; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Conductivity phenomena in semiconductors and insulators; Electronic transport in condensed matter; Electronics; Electronics and Microelectronics; Exact sciences and technology; Instrumentation; Instruments for strain, force and torque; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Materials Science; Mechanical instruments, equipment and techniques; Optical and Electronic Materials; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solid State Physics; Thermoelectric and thermomagnetic effects; Thermoelectric, pyroelectric devices, etc; thermal stress; Thermoelectric modules (TEMs); output power; conversion efficiency; thermoelectric material; Electrical conductivity; Output power; Computer software; Thermoelectric properties; Finite element method; Thermoelectric materials; Bismuth tellurides; Thermal resistance; Thermal parameter; Thermoelectric power; Cleavage; Thermal conductivity; Damage; Thermal stresses; Thermoelectric conversion; Stress analysis; Mechanical properties; Thermoelectric devices; Seebeck effect; Hot pressing; Transmission electron microscopy; Stress distribution; Anisotropy; Electric resistivity; Thermal analysis
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-011-1611-3

The output power and conversion efficiency of thermoelectric modules (TEMs) are mainly determined by their material properties, i.e., Seebeck coefficient, electrical resistivity, and thermal conductivity. In practical applications, due to the influence of the harsh environment, the mechanical properties of TEMs should also be considered. Using the finite-element analysis (FEA) model in ANSYS software, we present the thermal stress distribution of a TEM based on the anisotropic mechanical properties and thermoelectric properties of hot-pressed materials. By analyzing the possibilities of damage along the cleavage plane of Bi 2 Te 3 -based thermoelectric materials and by optimizing the structure parameters, a TEM with better mechanical performance is obtained. Thus, a direction for improving the thermal stress resistance of TEMs is presented.