Structural, dynamic magnetic and dielectric properties of Ni0.15Cu0.2Zn0.65Fe2O4 ferrite produced by NaOH co-precipitation method

• Published in: Journal of alloys and compounds Vol. 461; no. 1-2; pp. 373 - 377
• Main Authors: WANG, Hai-Bo, LIU, Jin-Hong, LI, Wen-Feng, WANG, Jian-Bo, LI WANG, SONG, Li-Jing, YUAN, Shi-Jun, LI, Fa-Shen
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier 11.08.2008
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Dielectric loss and relaxation; Dielectric properties of solids and liquids; Dielectrics, piezoelectrics, and ferroelectrics and their properties; Exact sciences and technology; Permittivity (dielectric function); Physics; Grain size; 75.40.Gb; Grain boundaries; Scanning electron microscopy; Cubic lattices; 61.72.-y; Calcination; XRD; Skin effect; Dielectric response; Precipitation; Ferrites spinels; Sintering; Dielectric losses; 81.40.Tv; 81.40.Rs; High frequency; Microstructure; Permittivity; Coprecipitation; Dielectric permeability
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2007.06.095

Cu-substituted NiZn ferrite of Ni0.15Cu0.2Zn0.65Fe2O4 was fabricated using a NaOH co-precipitation method. The effect of calcining as well as sintering temperature variation on the grain size, structural, dynamic magnetic and dielectric properties were investigated. X-ray diffraction measurements confirmed the formation of cubic spinel structure at all the temperatures for calcinations and sintering in this work. The microstructures were valued by SEM. The high frequency performance of the ferrite was estimated by measuring the frequency dispersion of the permeability, dielectric constant, dielectric loss and ac electrical resistivity. Compared with originally reported spinel ferrite, small liquid-like particles were found filling the grain boundaries of this copper-substituted NiZn ferrite, which has lower dielectric constant and dielectric loss. This could be an advantage for improving penetration depth by weakening the skin effect for high frequency applications.