A DEVELOPED FULL-FIELD FEM ANALYSIS COMBINED WITH ESPI FOR THE INVESTIGATION OF DEFECT EVOLUTION IN POLYMER FILMS

A full-field finite element method （FEM） analysis combined with electronic speckle pattern interferometry （ESPI） measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at seve...

Full description

Saved in:
Bibliographic Details
Published inChinese journal of polymer science Vol. 31; no. 7; pp. 1022 - 1028
Main Authors Liu, Xiao-fang, Tan, Shuai-xia, Zhang, Xiao-li, Zhao, Ning, Xu, Jian
Format Journal Article
LanguageEnglish
Published Heidelberg Chinese Chemical Society and Institute of Chemistry, CAS 01.07.2013
Subjects
Characterization and Evaluation of Materials
Chemistry
Chemistry and Materials Science
Condensed Matter Physics
GPC
Industrial Chemistry/Chemical Engineering
Polymer Sciences
化学
化学分子式
高分子化学
Finite element method
In-plane displacement
Defect
Polymer film
Electronic speckle pattern interferometry
Online AccessGet full text

Cover

More Information
Summary:A full-field finite element method （FEM） analysis combined with electronic speckle pattern interferometry （ESPI） measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at several points or lines, herein the full-field FEM results were exported, subtracted with a continuous distribution. By choosing proper parameters and number of substeps, the simulated and experimental results showed excellent correspondence. Furthermore, the displacement fields vertical to the tensional direction were also presented, and the strain field was preliminarily evaluated. The current method of combination of ESPI and FEM allows for capturing the experimental fringe maps to validate and optimize FEM results simulated, and would give a higher security to structural and mechanical analysis of polymeric materials.
Bibliography:Electronic speckle pattern interferometry; Finite element method; Defect; In-plane displacement; Polymer film.
A full-field finite element method （FEM） analysis combined with electronic speckle pattern interferometry （ESPI） measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at several points or lines, herein the full-field FEM results were exported, subtracted with a continuous distribution. By choosing proper parameters and number of substeps, the simulated and experimental results showed excellent correspondence. Furthermore, the displacement fields vertical to the tensional direction were also presented, and the strain field was preliminarily evaluated. The current method of combination of ESPI and FEM allows for capturing the experimental fringe maps to validate and optimize FEM results simulated, and would give a higher security to structural and mechanical analysis of polymeric materials.
11-2015/O6
ISSN:0256-7679
1439-6203
DOI:10.1007/s10118-013-1294-8