Thermal computer modeling of laser gyros at the design stage: a promising way to improve their quality and increase the economic efficiency of their development and production

• Published in: Optical and quantum electronics Vol. 53; no. 10
• Main Authors: Kuznetsov, Evgenii, Golyaev, Yury, Kolbas, Yury, Kofanov, Yury, Kuznetsov, Nikita, Vinokurov, Yury, Soloveva, Tatiana
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.10.2021; Springer Nature B.V
• Subjects: Algorithms; Characterization and Evaluation of Materials; Computer Communication Networks; Efficiency; Electrical Engineering; Electronic components; Electronic devices; Finite difference method; Grid method; Laboratory tests; Lasers; Modelling; Optical Devices; Optics; Overheating; Photonics; Physics; Physics and Astronomy; Thermal analysis; Zooming; Laser gyro; Computer simulation; Zooming technique; Graph method; ASONIKA; Electro-thermal analogies method; Grid method; Finite difference method
• ISSN: 0306-8919; 1572-817X
• DOI: 10.1007/s11082-021-03253-8

In the paper, we consider the ways to improve the quality and economic efficiency of development and production of complex innovative electronic devices, among which are laser gyros (LGs). Development, manufacturing and testing of high-tech LG are relatively expensive. The accurate thermal modeling at the early stages of LG designing is an effective way to reduce overall costs owing to noticeable savings of expenses on multiple-laboratory tests of the LG under development and its re-design due to overheating. Use of the inexpensive Russian computer system ASONIKA for thermal modeling provides yet another boost to cost efficiency. In the paper, details of application of the electro-thermal analogy method, finite difference method, grid method, graph method in ASONIKA are described. The developed algorithm of creation of LG thermal model with the procedure of step-by-step disaggregation (zooming technique) is presented. The process of LG modeling by ASONIKA computer system is explained; the created LG thermal model in graphic view and the obtained thermal field of one of PCB in colored view are demonstrated. Electronic components prone to overheating are specified. The paper also presents the results of empirical verification of modeling with actual measurement of temperature by the thermal sensors installed in places corresponding to the model nodes; those measurements confirmed high accuracy of ASONIKA-based simulation.