3D DRAM Design and Application to 3D Multicore Systems

From a system architecture perspective, 3D technology can satisfy the high memory bandwidth demands that future multicore/manycore architectures require. This article presents a 3D DRAM architecture design and the potential for using 3D DRAM stacking for both L2 cache and main memory in 3D multicore...

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Bibliographic Details
Published inIEEE design & test of computers Vol. 26; no. 5; pp. 36 - 47
Main Authors Hongbin Sun, Jibang Liu, Anigundi, R.S., Nanning Zheng, Jian-Qiang Lu, Rose, K., Tong Zhang
Format Journal Article
LanguageEnglish
Published IEEE Computer Society 01.09.2009
Subjects
3D integration
Architecture
Bandwidth
Bonding
Circuits
Computer architecture
Delay
Demand
design and test
Design engineering
DRAM
Dynamic random access memory
Fabrication
Logic arrays
Marketing
memory hierarchy
multicore
Multicore processing
Random access memory
Stacking
Three dimensional
Through-silicon vias
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Summary:From a system architecture perspective, 3D technology can satisfy the high memory bandwidth demands that future multicore/manycore architectures require. This article presents a 3D DRAM architecture design and the potential for using 3D DRAM stacking for both L2 cache and main memory in 3D multicore architecture.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0740-7475
1558-1918
DOI:10.1109/MDT.2009.105