孙凤莲, 刘. 梁. 黄. 袁. 张. (2015). Thermal simulation of flexible LED package enhanced with copper pillars. Journal of semiconductors, 36(6), 85-88. https://doi.org/10.1088/1674-4926/36/6/064011
Chicago Style (17th ed.) Citation孙凤莲, 刘洋 梁润园 黄洁莹 袁长安 张国旗. "Thermal Simulation of Flexible LED Package Enhanced with Copper Pillars." Journal of Semiconductors 36, no. 6 (2015): 85-88. https://doi.org/10.1088/1674-4926/36/6/064011.
MLA (9th ed.) Citation孙凤莲, 刘洋 梁润园 黄洁莹 袁长安 张国旗. "Thermal Simulation of Flexible LED Package Enhanced with Copper Pillars." Journal of Semiconductors, vol. 36, no. 6, 2015, pp. 85-88, https://doi.org/10.1088/1674-4926/36/6/064011.
Warning: These citations may not always be 100% accurate.