Thermal simulation of flexible LED package enhanced with copper pillars

• Published in: Journal of semiconductors Vol. 36; no. 6; pp. 85 - 88
• Main Author: 刘洋 梁润园 黄洁莹 袁长安 张国旗 孙凤莲
• Format: Journal Article
• Language: English
• Published: 01.06.2015
• Subjects: Chips; COF; Copper; DIODES; Heat transfer; LED; Light-emitting diodes; MATHEMATICAL ANALYSIS; Packages; PACKAGING; POLYIMIDES; SEMICONDUCTORS; Thermal resistance; 发光二极管; 封装技术; 有限元分析; 热仿真; 芯片温度; 铜柱
• ISSN: 1674-4926
• DOI: 10.1088/1674-4926/36/6/064011

Chip on flexible substrate （COF） is a new packaging technology for light emitting diodes （LED）. This paper investigated the effect of Cu-pillar in the polyimide （PI） layer on the thermal properties of COF LED pack- ages by finite element analysis. The thermal distribution and thermal resistance were studied in both COF LED packages with and without Cu-pillar. The PI layer showed the highest thermal resistance in the typical package and led to a high chip temperature. With the addition of Cu-pillars, however, the thermal resistance of the PI layer sig- nificantly decreased due to the improvement of vertical thermal dissipation under LED chips. Based on the results of simulation and calculation, the relationship between the amount of Cu-pillar and thermal resistance of the COF package has been built. For the packages studied in this research, an 8 × 8 Cu-pillars array was adequate to improve the thermal performance of COF packages.