Contact resistance asymmetry of amorphous indium–gallium–zinc–oxide thin-film transistors by scanning Kelvin probe microscopy
In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physic...
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Published in | Chinese physics B Vol. 25; no. 5; pp. 321 - 325 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physics is discussed. The present results suggest that the asymmetry of S/D contact resistance is caused by the difference in bias conditions of the Schottky-like junction at the contact interface induced by the parasitic reaction between contact metal and a-IGZO. The overall contact resistance should be determined by both the bulk channel resistance of the contact region and the interface properties of the metalsemiconductor junction. |
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Bibliography: | amorphous indium–gallium–zinc–oxide thin-film transistors; contact resistance; surface potential In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physics is discussed. The present results suggest that the asymmetry of S/D contact resistance is caused by the difference in bias conditions of the Schottky-like junction at the contact interface induced by the parasitic reaction between contact metal and a-IGZO. The overall contact resistance should be determined by both the bulk channel resistance of the contact region and the interface properties of the metalsemiconductor junction. 11-5639/O4 Chen-Fei Wu, Yun-Feng Chen, Hai Lu, Fang-Fang Ren, Dun-Jun Chen, Rong Zhang, Xiao-Ming Huang, and You-Dou Zheng( 1Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, and School of Electronic Science and Engineering Nanjing University, Nanjing 210093, China 2 Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China 3 Peter Grunberg Research Center, Nanjing University of Posts and Telecommunications, Nanjing 210003, China) ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 1674-1056 2058-3834 1741-4199 |
DOI: | 10.1088/1674-1056/25/5/057306 |