Contact resistance asymmetry of amorphous indium–gallium–zinc–oxide thin-film transistors by scanning Kelvin probe microscopy

In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physic...

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Published inChinese physics B Vol. 25; no. 5; pp. 321 - 325
Main Author 武辰飞 陈允峰 陆海 黄晓明 任芳芳 陈敦军 张荣 郑有炓
Format Journal Article
LanguageEnglish
Published 01.05.2016
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Summary:In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physics is discussed. The present results suggest that the asymmetry of S/D contact resistance is caused by the difference in bias conditions of the Schottky-like junction at the contact interface induced by the parasitic reaction between contact metal and a-IGZO. The overall contact resistance should be determined by both the bulk channel resistance of the contact region and the interface properties of the metalsemiconductor junction.
Bibliography:amorphous indium–gallium–zinc–oxide thin-film transistors; contact resistance; surface potential
In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain(S/D) series resistance in operating amorphous indium–gallium–zinc–oxide(a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physics is discussed. The present results suggest that the asymmetry of S/D contact resistance is caused by the difference in bias conditions of the Schottky-like junction at the contact interface induced by the parasitic reaction between contact metal and a-IGZO. The overall contact resistance should be determined by both the bulk channel resistance of the contact region and the interface properties of the metalsemiconductor junction.
11-5639/O4
Chen-Fei Wu, Yun-Feng Chen, Hai Lu, Fang-Fang Ren, Dun-Jun Chen, Rong Zhang, Xiao-Ming Huang, and You-Dou Zheng( 1Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, and School of Electronic Science and Engineering Nanjing University, Nanjing 210093, China 2 Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China 3 Peter Grunberg Research Center, Nanjing University of Posts and Telecommunications, Nanjing 210003, China)
ObjectType-Article-1
SourceType-Scholarly Journals-1
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ISSN:1674-1056
2058-3834
1741-4199
DOI:10.1088/1674-1056/25/5/057306