Parylene-AlOx Stacks for Improved 3D Encapsulation Solutions

The demand for ultra-tight encapsulation solutions with excellent barrier and high conformality properties has increased in recent years. To meet these challenges, thin-film barrier coatings have emerged as a promising solution. In this study, we investigate well-established silicon-based plasma-enh...

Full description

Saved in:
Bibliographic Details
Published inCoatings (Basel) Vol. 13; no. 11; p. 1942
Main Authors Buchwalder, Sébastien, Bourgeois, Florian, Leon, Juan J. Diaz, Hogg, Andreas, Burger, Jürgen
Format Journal Article
LanguageEnglish
Published Basel MDPI AG 01.11.2023
Subjects
Atomic layer epitaxy
Chemical vapor deposition
Coatings
Diodes
Encapsulation
Energy storage
Humidity
Investigations
Low temperature
Metal oxides
Microelectromechanical systems
Plasma
Plasma enhanced chemical vapor deposition
Polyethylene terephthalate
Relative humidity
Silicon nitride
Silicon wafers
Spectrum analysis
Temperature
Thin films
Water vapor
Online AccessGet full text

Cover

More Information
Summary:The demand for ultra-tight encapsulation solutions with excellent barrier and high conformality properties has increased in recent years. To meet these challenges, thin-film barrier coatings have emerged as a promising solution. In this study, we investigate well-established silicon-based plasma-enhanced chemical vapor deposition (PECVD) and metal oxide atomic layer deposition (ALD) barrier coatings deposited at low temperatures (≤100 °C) regarding their abilities to address high-level 3D encapsulation applications. Various combinations of such layers are evaluated by measuring the water vapor transmission rate (WVTR) and considering the conformality properties. The impact and the benefits of the organic film integration, namely parylene VT4 grade, on the barrier performances is assessed. Among these combinations, parylene-AlOx stack emerges as one of the most effective solutions, obtaining a WVTR of 3.1 × 10−4 g m−2 day−1 at 38 °C and 90% relative humidity conditions.
ISSN:2079-6412
2079-6412
DOI:10.3390/coatings13111942