The Finite Element Method for the Thermal Stress Analysis of Adhesive Bonded Structures and Its Applications

In this paper, the finite element method to analyze the thermal stresses of an adhesive bonded structure, of which the adherends are two-dimensional elastic bodies with optional shapes, is proposed. In the analytical model, the adhesive layer is assumed as the heat conductive pipe for the thermal co...

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Bibliographic Details
Published inTransactions of the Japan Society of Mechanical Engineers Series A Vol. 54; no. 497; pp. 119 - 125
Main Authors ODA, Juhachi, KIMOTO, Shinyo
Format Journal Article
LanguageJapanese
Published The Japan Society of Mechanical Engineers 1988
Subjects
Adheslve Bonded Structure
Elasticity
Numerical Analysis
Structural Analysis
Thermal Stress
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Summary:In this paper, the finite element method to analyze the thermal stresses of an adhesive bonded structure, of which the adherends are two-dimensional elastic bodies with optional shapes, is proposed. In the analytical model, the adhesive layer is assumed as the heat conductive pipe for the thermal condition and as the spring element transmitting only a shearing force for the dynamical load condition. These stiffness matrices are formulated to match the well-known finite element method for in-plane analysis of the plate. By using this method, the stress distributions of adhesive bonded structures, of which the adherends are composed of copper and acrylic resin plates, under uniform and nonuniform temperature fields are analyzed. From the results, it is established that the shearing stress at the adhesive layer reaches very large values at the boundaries between the two plates.
ISSN:0387-5008
1884-8338
DOI:10.1299/kikaia.54.119