Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model

In this paper the analysis of the influence of the temperature time lag and the heat flux time lag on the temperature distribution obtained using Dual-Phase-Lag heat transfer model is presented. Due to this fact, the modern GAAFET structure, developed in 5 nm technology node, has been taken into acc...

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 86; pp. 10 - 19
Main Authors Raszkowski, Tomasz, Samson, Agnieszka, Zubert, Mariusz
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.07.2018
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Summary:In this paper the analysis of the influence of the temperature time lag and the heat flux time lag on the temperature distribution obtained using Dual-Phase-Lag heat transfer model is presented. Due to this fact, the modern GAAFET structure, developed in 5 nm technology node, has been taken into account. The simulation presents the influence of mentioned time lags on the temperature distribution inside analyzed structure for different time instants in three cases. The first one is related to the situation when the temperature time lag is changing and the value of the heat flux time lag is fixed. The second one concerns the changing value of the heat flux time lag and fixed value of the temperature time lag. The last case allows changing of these two parameters simultaneously. Apart from that, the temperature distributions inside the structure for some pairs of different values of analyzed time lags have been also evaluated and compared for certain time instants. •The influence of Dual-Phase-Lag parameters on temperature distribution is shown.•Modern 5 nm GAAFET structure is taken into account.•The smaller temperature and heat flux time lag values the higher temperature value.•Heat flux time lag has stronger influence on temperature than temperature time lag.•Investigated time lags are crucial for proper temperature distribution modelling.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2018.05.004