Development of shape memory alloy fiber reinforced debondable adhesive

This study introduces an innovative debondable adhesive approach by incorporating shape-memory alloy (SMA) fibers within an epoxy adhesive matrix. Employing meticulous techniques, such as winding machinery and other apparatuses, exceedingly thin Nitinol SMA fibers have been successfully integrated i...

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Bibliographic Details
Published inInternational journal of adhesion and adhesives Vol. 128; p. 103544
Main Authors Moktadir, Monem, Hwang, Hui-Yun
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.01.2024
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Summary:This study introduces an innovative debondable adhesive approach by incorporating shape-memory alloy (SMA) fibers within an epoxy adhesive matrix. Employing meticulous techniques, such as winding machinery and other apparatuses, exceedingly thin Nitinol SMA fibers have been successfully integrated into the adhesive layer. Notably, this adhesive exhibits the dual functionality of a fiber-reinforced composite at operational temperatures, conferring heightened joint strength. Upon disassembly at elevated temperatures, the shape-memory effect of the fibers induces stress concentration within the adhesive layer, thereby facilitating effortless debonding and significantly enhancing the recycling efficacy. Various configurations of fiber volume fractions (2.5 %, 5.0 %, 10.0 %) and orientations (0°/0°, 0°/90°, 90°/90°) were explored to assess their impact on joint strength across ambient and elevated temperatures. The investigation reveals that the 0°/0° fiber orientation yields optimal debondable adhesive characteristics. Additionally, higher volumetric percentages generally correlate with improved adhesive strength and debonding capability. This study further elucidates the underlying mechanisms governing the observed effects on joint debonding strength. •Functional adhesive acting according to the concept of fiber-reinforced plastics.•Nitinol micro-fiber embedded inside epoxy.•Winding machine capable of shape memory alloy fiber placement.•High adhesion strength at operating temperature.•Shape memory effect assisted easy debonding ability.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2023.103544