Package compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering

Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated t...

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Bibliographic Details
Published inJournal of applied physics Vol. 99; no. 8; pp. 08M301 - 08M301-3
Main Authors Li, Liangliang, Wang, Shan X., Hwang, Kyu-Pyung, Min, Yongki, Mao, Ming, Schneider, Thomas, Bubber, Randhir
Format Journal Article
LanguageEnglish
Published United States American Institute of Physics 15.04.2006
Subjects
ATOMIC FORCE MICROSCOPY
COBALT COMPOUNDS
CRYSTAL STRUCTURE
GRANULAR MATERIALS
HAFNIUM OXIDES
IRON COMPOUNDS
MAGNETIC MATERIALS
MAGNETIC PROPERTIES
MATERIALS SCIENCE
MECHANICAL POLISHING
MICROSTRUCTURE
PRINTED CIRCUITS
SPUTTERING
SUBSTRATES
SURFACE COATING
THIN FILMS
X-RAY DIFFRACTION
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Summary:Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.2158973